Mikroelektronika d.o.o.
BLE P Click-Platine
BLE P Click-Platine
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Overview
Der BLE P Click Board™ enthält den nRF8001 IC, mit dem Sie Ihrem Gerät Bluetooth 4.0 hinzufügen können . Das Click kommuniziert mit der Zielplatinen-MCU über mikroBUS™ SPI (CS, SCK, MISO, MOSI), RDY- und ACT-Leitungen und läuft mit einer 3,3-V-Stromversorgung.
Key Features
- nRF8001 Bluetooth low energy RF transceiver
- 16 MHz crystal oscillator
- Ultra-low peak current consumption <14 mA
- Low current for connection oriented profiles, typically 2 μA
- PCB trace antenna
- BLE Android app
- Interface: SPI
- 3.3V power supply
IC/Module: nRF8001 Single Chip Bluetooth Low Energy IC
nRF8001, a highly integrated Bluetooth Smart Connectivity IC, has a simple serial interface that supports a wide range of external application microcontrollers. It is designed with a fully compliant Bluetooth Smart v4.0 Radio, Link Layer, and Host stack. With low-power consumption, it is specifically designed for Bluetooth Smart applications that operate in the peripheral (slave) role.
BLE Android App
An open-source android app has been developed that works on all devices with hardware and software support for BLE. The users can use this app as a starting point for developing their own apps.
Embedded Stack
The stack aboard the BLE P Click Board™ has a low energy PHY layer, low energy link layer slave, low energy host for devices in the peripheral role and an Application Controller Interface (ACI).
PCB trace antenna
BLE P Click Board™ features a PCB trace antenna that works in 2400-2483.5 MHz frequency band. It has a maximum device range up to 40 meters in open space.
Frequently Asked Questions
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