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IC/module: LPS331AP

LPS331AP is a digital output pressure sensor offered in an ultra-compact holed cap land grid array package. Designed to measure pressure or temperature, this chip features a monolithic sensing element that detects pressure while an IC interface that takes information from the sensing element and provide a digital signal to the external world.

Manufacturing Process: VENSENS

Intended to detect pressure, LPS331AP pressure sensor is manufactured using a specific proprietary process called VENSENS. It allows to build a mono-silicon membrane above an air cavity with controlled gap and defined pressure. Compared to traditional silicon micro-machined membranes, this membrane is very small. Intrinsic mechanical stoppers prevent membrane breakage.

SMD Jumpers

Depending on the position of four jumpers,